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12-Bit + Sign Digital Temperature Sensors
with Serial Interface
Applications Information
Thermal Considerations
The key to accurate temperature monitoring is good
Functional Diagram
thermal contact between the MAX6629–MAX6632 pack-
age and the object being monitored. In some applica-
tions, the 6-pin SOT23 package is small enough to fit
underneath a socketed μP, allowing the device to moni-
tor the μP’s temperature directly. Accurate temperature
monitoring depends on the thermal resistance between
the object being monitored and the MAX6629–MAX6632
die. Heat flows in and out of plastic packages primarily
through the leads. If the sensor is intended to measure
MAX6629
MAX6630
MAX6631
MAX6632
TEMPERATURE
SENSOR
12-BIT + SIGN
∑Δ ADC
VOLTAGE
REFERENCE
the temperature of a heat-generating component on the
circuit board, it should be mounted as close as possible
to that component and should share supply and ground
traces (if they are not noisy) with that component where
possible. This maximizes the heat transfer from the com-
ponent to the sensor.
SPI-COMPATIBLE
INTERFACE
CS
SCK
SO
The MAX6629/MAX6630 supply current is typically
200μA, and the MAX6631/MAX6632 supply current is
typically 32μA. When used to drive high-impedance
loads, the device dissipates negligible power.
Therefore, the die temperature is essentially the same
as the package temperature.
The rise in die temperature due to self-heating is given
by the following formula:
Δ T J = P DISSIPATION x θ JA
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns,
go to www.maxim-ic.com/packages . Note that a “+”, “#”, or
“-” in the package code indicates RoHS status only. Package
drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
where P DISSIPATION is the power dissipated by the
MAX6629–MAX6632, and θ JA is the package’s thermal
resistance.
The typical thermal resistance is +110°C/W for the
PACKAGE TYPE
6 SOT23
6 TDFN-EP
PACKAGE CODE
U6FH-6
T633+2
DOCUMENT NO.
6-pin SOT23 package. To limit the effects of self-heat-
ing, minimize the output currents. For example, if the
MAX6629–MAX6632 sink 1mA, the output voltage is
guaranteed to be less than 0.4V. Therefore, an addi-
tional 0.4mW of power is dissipated within the IC. This
corresponds to a 0.044°C shift in the die temperature in
the 6-pin SOT23.
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